Intel's upcoming Nova Lake H mobile processor has appeared in a leaked image, offering an early look at the architecture expected to power its next generation of laptops.
The processor, reportedly belonging to the Core Ultra 4000H family, features a six tile design that separates computing, graphics and other functions into individual components.
The leaked information suggests Intel will continue using a modular processor architecture, potentially combining manufacturing technologies from its own foundries and TSMC.
However, Intel has not officially confirmed the specifications or manufacturing details, so the information remains preliminary.
Intel Nova Lake H Could Feature 16 Cores Across Multiple Tiles
The image, shared by hardware leaker @momomo_us, shows a compact processor package containing six distinct tiles.
These reportedly include a Compute Tile, Graphics Tile, Hub/SoC Tile, Peripheral Controller Tile and two passive tiles that provide structural support.
The Compute Tile is expected to feature four Performance cores and eight Efficiency cores.
Another four Low Power Efficiency cores would reportedly be integrated into the Hub/SoC Tile, bringing the total to 16 CPU cores.
According to the leaked analysis, different sections of the processor could use separate manufacturing processes.
| Component | Reported specifications |
|---|---|
| Compute Tile | 12 CPU cores, 55 mm², TSMC N2P |
| Hub/SoC Tile | 4 Low Power E cores, 72 mm², Intel 18A P |
| Peripheral Controller Tile | 58 mm², Intel 18A P |
| Graphics Tile | 4 Xe3 GPU cores, 26 mm², Intel 3 E |
The two passive tiles are reportedly positioned near the computing and graphics sections.
This design could allow Intel to modify individual components when developing processors for different performance requirements.
Nova Lake HX Could Offer a Larger 24 Core Configuration
The higher performance Nova Lake HX series is also expected to use a similar six tile architecture.
However, its Compute Tile could contain eight Performance cores and 16 Efficiency cores, delivering 24 cores before accounting for any additional Low Power Efficiency cores.
The larger Compute Tile reportedly measures approximately 104 mm².
Leaked information also indicates that the HX package will be larger than the standard H variant, with reported dimensions of 12 x 30mm compared with 12 x 23mm.
Intel could potentially introduce additional graphics configurations by replacing the smaller Xe3 tile with a larger alternative.
For now, the leaked image provides an indication of Intel's architectural direction, but performance, power consumption and final configurations remain unconfirmed.
More details should become available as Intel approaches the official introduction of its Nova Lake mobile processors.
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