Intel’s foundry comeback may be getting a major confidence boost. A new report claims that Apple and Google are preparing to use some of Intel’s next-generation manufacturing and packaging technologies, including 18A-P and EMIB. If accurate, this would be a big moment for Intel’s plan to become a serious alternative to TSMC for advanced chip production.
The report, citing China Times and supply chain sources, says some customers have already started test chip verification on Intel’s 18A process. Intel is also preparing 18A-P, an improved version of 18A, while its 14A process is moving forward for future customers.
Intel’s foundry business needs outside customers, and Apple or Google would send a strong message to the chip industry
Intel has spent years trying to rebuild trust in its manufacturing roadmap. The company is not only making chips for itself anymore. It wants to manufacture chips for other companies, which puts it in direct competition with TSMC and Samsung Foundry.
That is why Apple and Google matter so much. Apple is one of the biggest and most demanding chip customers in the world, while Google is building more of its own AI hardware through the TPU line. If either company uses Intel Foundry in a meaningful way, it would suggest that Intel’s process and packaging technology is becoming more attractive to major customers.
According to the report, Apple may use Intel’s 18A-P process for future M-series chips used in client devices. Google, meanwhile, is said to be interested in Intel’s EMIB advanced packaging for a future TPUv8e chip. These are still reports, not official deal announcements, so they should be treated carefully. Intel has not publicly named Apple or Google as major foundry customers for these products.
| Intel technology | Reported customer interest | Why it matters |
|---|---|---|
| 18A | Test chip verification from several customers | Shows customers are checking whether Intel’s process is ready |
| 18A-P | Reportedly linked to future Apple M chips | Could help Intel prove it can serve a top-tier chip designer |
| EMIB | Reportedly linked to Google TPUv8e | Helps Intel compete in advanced AI chip packaging |
| 14A | Customers said to be lining up | Could become Intel’s next major foundry test after 18A |
The timing also helps explain why companies may be looking at Intel. AI demand has placed huge pressure on the semiconductor supply chain. TSMC remains the leader, but its most advanced capacity is in high demand. If Intel can offer a reliable second source for advanced chips and packaging, some customers may want that flexibility.
Intel has also said that 18A high-volume manufacturing has been reached with Panther Lake, its own upcoming product. That is important because Intel needs to prove its technology first with internal chips before outside customers fully trust it.
The 18A-P process is described as offering an 8% performance-per-watt gain while keeping the same density as 18A. That may not sound dramatic, but in chip design, small efficiency gains can matter a lot, especially for laptops, tablets, and other power-sensitive devices.
Still, Intel has to turn reported interest into real production wins. Test chips and early verification are not the same as mass production contracts. Apple and Google will only move serious products to Intel if the process, yield, cost, packaging, and delivery schedule all make sense.
For now, the report suggests Intel’s foundry story is getting more believable. If Apple really uses 18A-P and Google really adopts EMIB for future AI hardware, Intel would gain more than revenue. It would gain the kind of industry trust it has been chasing for years.
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