SK hynix reportedly works with Intel on EMIB packaging as AI chip bottlenecks grow
SK hynix is reportedly working with Intel on advanced chip packaging as AI demand continues to strain the semiconductor supply chain. The focus is Intel’s EMIB technology, short for Embedded Multi die Interconnect Bridge. It is an advanced packaging method that can connect multiple chip parts more efficiently without relying on the same full interposer approach used in some other 2.5D packaging methods. This